•Structure cabling for horizontal and building backbone 10G BASE-T (IEEE 802.3an)*55m
•2.5G/5G BASE-T (IEEE 802.3bz)
•10/100/1000 BASE-T (IEEE 802.3i/u/ab)
•IEEE 802.3af/at (PoE/PoE+)
•52/155/622 Mbps and 1.2 Gbps ATM
•4/16 Mbps Token Ring
•TP-PMD TPDDI ISDN CDDI VoIP
•HD BaseT 2.0 standard Baseband Broadband
•Digital & Analog for data / video and audio application
•ELECTRICAL CHARACTERSTICS
•Impedance : 100±5 ohm 1 MHz to 250 MHz
•Mutual Capacitance : 5.6 nFMax /100m
•Capacitance / Unbalance : 160 pF Max/100m
•DC Resistance : 7.32 ohm Max/100m
•DC Resistance / Unbalance : 5% Max.
•Insulated Resistance : 5000 Mohm/Km
•Dielectric Strength : 1kV/min
•Propagation Delay : 536 ns/100m Max @250MHz
•Delay Skew : 30 ns Max
•CONSTRUCTION / MATERIAL
•Conductor : 23AWG Solid Bare copper
•Insulation : HDPE
•Filler Slot : FRPE
•Ripcord : Under Jacket
•Jacket : FR-PVC