Product description
* Heat conductive silicone thermal compound pads.
*The thermal pads can avoid the uneven application between the heatsinks and IC chips.
* Help to improve the effectiveness of your heatsink and reduce the operating temperature of your processor,video card, decreasing the chance of premature failure.
* Suitable for GPU CPU VGA for BGA Bridge Chips.
* Temp.: -40degree Celsius-260degree Celsius
* Thermal Conductivity: 3.2w/m-K
* Breakdown Voltage: 4kv/mm
The real color of the item may be slightly different from the pictures shown on website caused by many factors such as brightness of your monitor and light brightness.